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March 2006

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Subject:
From:
"Gervascio, Thomas" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gervascio, Thomas
Date:
Tue, 28 Mar 2006 11:02:34 -0500
Content-Type:
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We had problems with solderability of some QFPs when the vendor went to
a gold over immersion tin finish. The gold was very thin - less than 10
microinches and we had to go to a more aggressive ROL0 solder paste to
get acceptable solder joints. 

Nickel solderability is a real problem and some sort of surface finish
should be used to protect the nickel from oxidizing- but we had problem
with thin gold finish  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bloomquist, Ken
Sent: Tuesday, March 28, 2006 9:11 AM
To: [log in to unmask]
Subject: [TN] Nickel Lead Finish

We were just notified by one of our capacitor manufacturers that they
were going lead free and their replacement finish will be nickel. These
are surface mount parts.

If my memory serves we had trouble soldering nickel leads some years ago
on some TO-5 parts.

We are a class 3 manufacturer and will continue to use lead in our
solder. Should we be concerned about the solderability of the nickel
lead finishes?

Thanks,

KennyB

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