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March 2006

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Subject:
From:
Dave Seymour <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dave Seymour <[log in to unmask]>
Date:
Tue, 28 Mar 2006 10:30:33 -0500
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Currently using a Phillips part,

http://www.semiconductors.philips.com/pip/NE57814DD.html

This is a  standard SO8 package with a large "heat slug pad" under the part.

During reflow the part is floating off center and causing shorts to the
lead pads.
I believe this because of the the volume of paste in the heat slug area
is lifting the
part up and surface tensions take over.

I have a call into tech support at Phillips, but I figured I would query
while waiting for a call back.

What is the recommended volume of solder paste under this device ?

What is the recommended solder mask opening(s) under this device?
- Something like 4-6 smaller opening over a continuous top side
 ground plane?

What is the recommended paste printing pattern under this device?
- match the soldermask openings?

Does anyone have experience with such a device?

Thanks,

Dave


--
Dave Seymour, CID+
Catapult Communications Inc.
800 Perimeter Park Dr, Suite A
Morrisville, NC 27560

Direct: (919)653-4249
Main: (919)653-4180
Fax: (919)653-4297

[log in to unmask]

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