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March 2006

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Mon, 27 Mar 2006 13:25:19 -0500
Content-Type:
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        In a previous, we used to coat boards and under fill BGAs with
silicone. It worked fine. Just have to program the automatic CC machine
in a proper way, use squirt, instead of spray; starting from the same
corner down one side and next the adjacent side. It filled the underside
and left no bubbles.
        Ramon
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Macko, Joe @ IEC
Sent: Monday, March 27, 2006 12:37 PM
To: [log in to unmask]
Subject: Re: [TN] Conformal coating and BGA

Gil,

Hello.
I have not heard of any restriction or problems applying c/c to the tops
of BGAs however, this does not coat the solder joints (SJs) located
under the BGA package, which is required by IPC-A-610. So, c/c BGAs does
not apply c/c to the actual SJs located under the package, which
violates IPC-A-610 acceptability requirements. We have used various
wickable underfills to seal SJs located under BGA packages.

joe

-----Original Message-----
From: Zilber Gil [mailto:[log in to unmask]]
Sent: Monday, March 27, 2006 8:17 AM
To: [log in to unmask]
Subject: [TN] Conformal coating and BGA

Hello All,

Are their any restrictions of applying conformal coating on BGA
components (Mil, Jedec, etc.)-i.e. on top of the BGA, avoiding
underneath it, etc.?

Thanks,


Dr. Gil Zilber
Technologist, Elta system Ltd.
Tel. +972-8-8577240
Mobile +972-54-4983222
http://www.iai.co.il/site/en/iai.asp?pi=17887



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