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March 2006

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Subject:
From:
Jeffrey Bush <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jeffrey Bush <[log in to unmask]>
Date:
Mon, 27 Mar 2006 13:16:03 -0500
Content-Type:
text/plain
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Have the potential supplier complete IPC-1710 to assess the companies  capabilities.  Validate the responses to the IPC-1710 via a site survey.

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 21
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 
                           

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of jose
Sent: Monday, March 27, 2006 1:10 PM
To: [log in to unmask]
Subject: [TN] PCB Manufactrurer Qualification Process

Does anyone know about any recommended PCB Manufacturer qualification
process?

Thanks.

Jose R.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
Sent: Monday, March 27, 2006 9:24 AM
To: [log in to unmask]
Subject: Re: [TN] Lead free solders

My 2¢.

Are you 100% sure the flux was no clean?  That sounds like a water soluble
(OA) problem where the flux was not removed.  It could also be that the
no-clean flux was not properly activated to neutralize the flux.

As for eating the copper, I have seen Litz wire eroded away by leaving it in
the dip pot for too long.  When placed in the pot for about 5 seconds it
works perfectly.

Phil

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of stephen gregory
Sent: Monday, March 27, 2006 12:09 PM
To: [log in to unmask]
Subject: Re: [TN] Lead free solders

Steve,

  Are you sure that it was the flux? What I have heard is that the copper
will dissolve because of the high tin content of lead free solders. This was
further illustrated to me when I asked the question about removing
insulation and tinning Litz wire. One of the recommendations that was made
to me was to use a low tin content solder (70Pb/30Sn) to avoid "necking", or
dissolving the copper wire.

  I have also heard about problems with trying to rework lead free solder
joints...small pads will sometimes just disappear.

  -Steve Gregory-

Steve Kelly <[log in to unmask]> wrote:
  Good Morning,
Can any one point me to some papers showing problems with no-clean lead
free flux. I just returned from a customer who did some extensive
thermal cycling on some parts we soldered with no -clean lead free 96.5%
tin, 3% silver, and .5% copper. The flux was so active it started to eat
through the copper. Not a pretty sight. Thanks in advance. Steve Kelly

Steve Kelly
PH: (416) 750-8433
FAX: (416) 750-0016
CELL: (416) 577-8433


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