TECHNET Archives

March 2006

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Conformal coating and BGA
From:
"Macko, Joe @ IEC" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Macko, Joe @ IEC
Date:
Mon, 27 Mar 2006 09:36:51 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (74 lines) 
Gil,

Hello.
I have not heard of any restriction or problems applying c/c to the tops of
BGAs however, this does not coat the solder joints (SJs) located under the
BGA package, which is required by IPC-A-610. So, c/c BGAs does not apply c/c
to the actual SJs located under the package, which violates IPC-A-610
acceptability requirements. We have used various wickable underfills to seal
SJs located under BGA packages.

joe

-----Original Message-----
From: Zilber Gil [mailto:[log in to unmask]]
Sent: Monday, March 27, 2006 8:17 AM
To: [log in to unmask]
Subject: [TN] Conformal coating and BGA

Hello All,

Are their any restrictions of applying conformal coating on BGA
components (Mil, Jedec, etc.)-i.e. on top of the BGA, avoiding
underneath it, etc.?

Thanks,


Dr. Gil Zilber
Technologist, Elta system Ltd.
Tel. +972-8-8577240
Mobile +972-54-4983222
http://www.iai.co.il/site/en/iai.asp?pi=17887



 The information contained in this communication is proprietary to Israel
Aircraft Industries Ltd.
and/or third parties, may contain confidential or privileged information,
and is intended only for
the use of the intended addressee thereof. If you are not the intended
addressee, please be aware
that any use, disclosure, distribution and/or copying of this communication
is strictly prohibited.
If you receive this communication in error, please notify the sender
immediately and delete it from
your computer. Thank you.


This message is processed by the PrivaWall Email Security Server.

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2