Subject: | |
From: | |
Reply To: | |
Date: | Fri, 24 Mar 2006 12:01:04 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Darrel,
Before you go with any of the suggested technologies (blind/buried,VIP)
contact your preferred vendor and make sure to get their input. No point
creating a board that will be difficult, impossible or cost prohibitive to
build.
John Parsons
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Happy Holden
Sent: Friday, March 24, 2006 11:34 AM
To: [log in to unmask]
Subject: Re: [TN] Blind/Buried Vias
Yes, Darrel,
Use via-in-pad to gain additional routing and via space. For costing, see
the "Cost & Density Tradeoffs" at www.westwoodpcb.com. Click on the
upper-left button labelled "TH vs HDI". There is also design rules and
routing articles under "Technical Services" that you can download.
Happy Holden
Asian Pacific Materials
Darrel Therriault <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
03/24/2006 01:34 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
[log in to unmask]
To
[log in to unmask]
cc
Subject
[TN] Blind/Buried Vias
Technetters,
We have a design that is very dense and routing is going to be a
challange.
Is there any rule of thumb for gaining routing space by going to blind and
buried vias relative to standard vias (We can't increase layer count)?
Is there any rule of thumb for a cost increase one would expect to incur?
Any info appreciated.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
Thanks....DJT
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|