Yes, Darrel,
Use via-in-pad to gain additional routing and via space. For costing, see
the "Cost & Density Tradeoffs" at www.westwoodpcb.com. Click on the
upper-left button labelled "TH vs HDI". There is also design rules and
routing articles under "Technical Services" that you can download.
Happy Holden
Asian Pacific Materials
Darrel Therriault <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
03/24/2006 01:34 PM
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[TN] Blind/Buried Vias
Technetters,
We have a design that is very dense and routing is going to be a
challange.
Is there any rule of thumb for gaining routing space by going to blind and
buried vias relative to standard vias (We can't increase layer count)?
Is there any rule of thumb for a cost increase one would expect to incur?
Any info appreciated.
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Thanks....DJT
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