Dewey:
I hear you loud and clear. In the near future thanks to
some crazy fellows that want to save the earth.... We may have to go
that route per customer request. Other choices ensure that the Tin
finish is Matte, bigger grain, instead of bright tin ( do not know yet
how to verify that), have at least 3% Pb or 3-5% Bi( use of XRF) , CC
assembly, annealing components, reflow assembly, immersion Tin
finish.... My understanding of Immersion tin is that it does not
promote Whiskers. The problem that I know about this finish, ImSn, is
that it is too thin and IMC form to make it unwetable.
Thanks for your sharing,
Regards,
Ramon
-----Original Message-----
From: Whittaker, Dewey (AZ75) [mailto:[log in to unmask]]
Sent: Friday, March 24, 2006 10:39 AM
To: TechNet E-Mail Forum; Dehoyos, Ramon
Subject: RE: [TN] Tin Whisker Mitigation
Ramon,
Yes.
Don't do it and spare yourself the cruel and unusual punishment.
Depending on your customers and critical end-use applications, the
amount of effort to do this and control it is incredible. It can be
done, but it extracts a heavy toll. Even meager efforts in-house with
chips is a waste of dough( now class did you catch the joke? Toll house
morsels = Chips( chocolate) = waste of dough. Good you earned your
chocolate chip cookie).
Dewey
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Friday, March 24, 2006 8:18 AM
To: [log in to unmask]
Subject: [TN] Tin Whisker Mitigation
Hello TechNetters:
Does anyone know of companies that are replating parts with Sn63
and reballing BGAs? Could any one share their experiences in
doing this effort? Things such as: extra time needed, cost,
reliability.......
Regards and TIA,
Ramon Dehoyos,
410.552.2210
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