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March 2006

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Subject:
From:
Leo Higgins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leo Higgins <[log in to unmask]>
Date:
Fri, 24 Mar 2006 08:16:41 -0800
Content-Type:
text/plain
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text/plain (78 lines)
In several studies I have seen this opposing BGA configuration resulted in
fewer temp cycles to failure than when TC testing was run with only one side
BGA attached.  Qualitatively, this effect is likely to be more severe for
"larger" BGAs on "thinner" boards.


Best regards,
Leo

Leo M. Higgins III, Ph.D.
Vice President, Technical Support Operations
ASAT, Inc.
3755 Capital of Texas Highway, Suite 100
Austin, Texas     78704

office phone   512-383-4593
mobile           512-423-2002
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www.asat.com


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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Tempea, Ioan
Sent: Friday, March 24, 2006 8:30 AM
To: [log in to unmask]
Subject: [TN] Superposed BGAs


Hi Technos,

I am reviewing have a PCB design draft which has 2 MEG-Array BGA connectors
from FCI. The problem is that one is on the topside and the second one on
the bottom side, their locations perfectly overlapping. Otherwise said they
one on top of the other.

I remember having seen a thread on Technet a few years ago stating that this
construction is not reliable. Unfortunately I cannot find the e-mails in the
archive.

What would be your take on this?

Thank you,
Ioan

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