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March 2006

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Subject:
From:
"Whittaker, Dewey (AZ75)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (AZ75)
Date:
Fri, 24 Mar 2006 08:38:50 -0700
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text/plain
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Ramon,
Yes.
Don't do it and spare yourself the cruel and unusual punishment.
Depending on your customers and critical end-use applications, the
amount of effort to do this and control it is incredible. It can be
done, but it extracts a heavy toll. Even meager efforts in-house with
chips is a waste of dough( now class did you catch the joke? Toll house
morsels = Chips( chocolate) = waste of dough. Good you earned your
chocolate chip cookie).
Dewey 
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Friday, March 24, 2006 8:18 AM
To: [log in to unmask]
Subject: [TN] Tin Whisker Mitigation

 

        Hello TechNetters:
                        	
        Does anyone know of companies that are replating parts with Sn63
and reballing BGAs? Could any one share         their experiences in
doing this effort? Things such as:  extra time needed, cost,
reliability....... 
        Regards and TIA,
        Ramon Dehoyos,
        410.552.2210

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