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March 2006

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dehoyos, Ramon
Date:
Fri, 24 Mar 2006 08:38:28 -0500
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        Hi Dacia:
        The solder spheres may start oxidizing when the flux stops
shielding it from the ambient. We are very strict with solder. It has a
shelf life when refrigerated, a time after it is thawed out, and a time
after it is dispensed. It is not worthy to risk to have voids in the
solder or other anomalies. Perhaps in the case of large quantities of
solder that has extended its shelf life, the best way to handle it is to
return it to the manufacturer for credit.
        Regards,
        Ramon
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dacia Schoolfield
Sent: Thursday, March 23, 2006 12:15 PM
To: [log in to unmask]
Subject: [TN] Solder Paste Question

Gurus of the manufacturing industry -


What is your take on adding RMA flux to solder paste - either new paste
or used paste?  Is there a difference in results when adding flux to
leaded versus non-leaded paste?


For those of you who do add additional flux to paste, what types of
controls do you have in place to ensure the paste itself is still
viable?


I understand this is an extremely general question, and am looking for
general answers.... or, if anyone has recommendations as far as
research, I would gladly accept all input.



I appreciate your thoughts.
Dacia

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