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March 2006

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Thu, 2 Mar 2006 18:10:47 +0200
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Could you "glob" the repairs with a good, electrical-grade epoxy resin?

DeVaul, Tim wrote:
> I have a question regarding the validity of a proposed repair to a power
> supply assembly we produce. It is produced as a class 2 product and the
> proposed repair involves staking two SMT caps and a resistor to the PCD
> board and running jumper wires to adjacent components. My concern is the
> components are only bonded to the board and with vibration and
> temperature change that could dislodge the components over time.
>
>
>
> Has anyone had experience with this type of repair?
>
>
>
>
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>
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