Many discrete components (Kemet, Rohm) have been lead free for over 10
years.  So nothing has changed in there parts.
Is there anyone from these industries out there who cares to comment?

Sincerely,
-----------------------------------
Cheryl Johnson, C.I.D.+
Manager
ExcelStor US Office, Engineering Services
Email: [log in to unmask]
Tel: (303) 684-7291
Fax: (303) 684-7268
Mobile: (303) 809-5815
-----------------------------------


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of - Bogert
Sent: Thursday, March 23, 2006 4:46 AM
To: [log in to unmask]
Subject: [TN] Seeking date that part manufacturers started eliminating
lead from part finishes


March 23, 2006

Folks, my understanding is that about 50% of the electronic part
manufacturers have been eliminating Pb from their part finishes without also
changing their part numbers.  I am concerned that because of this, we may
inadvertently be getting lead-free parts and mixing these with lead-bearing
parts.  Concerns are possible tin-whiskers (since pure tin is sometimes used
in lieu of Pb for finishes) and solder joint issues when soldering lead-free
using Sn63 solder.

We have a lot of delivered equipment that I am trying to determine if we
could have these issues.  One way to bound the problem would be to determine
a date by when most part manufacturers starting phasing out Pb from their
part finishes.  Knowing this date, we may be able to accept equipment
manufactured prior to this date with minimum risk.  One possible date may be
the date RoHS started.

Do you folks know of a date that would give me a warm fuzzy that equipment
delivered prior to this date should not be subject to the
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lead-free issues?

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