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March 2006

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From:
Mike Fenner <[log in to unmask]>
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Date:
Thu, 23 Mar 2006 14:36:17 -0000
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There is no single date you can apply. If you want to do this you will have
to slog each one. Pb-free has been coming for years and already arrived in
Japan some years ago. So different suppliers will be in different stages.
Also some will have been Pb free for some time but not necessarily RoHS
compliant. Others will have been Pb-free (in the sense of not happening to
use lead finish) but not Pb-free temperature processable and so on. In
addition it is possible that any surplus non ROHS compliant stock will end
up in USA as it will not be saleable in Europe. Lets hope that you don't end
up with wooden leads from a soldering point of view....

Pragmatically
Apart from BGA Pb-free finishes are compatible with Sn63. I don't think you
will have issues soldering RoHS compliant parts with Sn63 solder. Many parts
have always used finishes which didn't happen to contain lead.
Tin whiskering is still a concern in a Pb free environment so precautions
are taken against that in RoHS compliant parts just as before. The
precautions have to be RoHS compliant so for example BI may be doped into
finish instead of Pb. This does represent a change although it may have no
functional or processing significance.




Regards

Mike Fenner
Indium Corporation

T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
E: [log in to unmask]
W: www.indium.com
Pb-free: www.Pb-Free.com



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of - Bogert
Sent: Thursday, March 23, 2006 6:46 AM
To: [log in to unmask]
Subject: [TN] Seeking date that part manufacturers started eliminating lead
from part finishes

March 23, 2006

Folks, my understanding is that about 50% of the electronic part
manufacturers have been eliminating Pb from their part finishes without also
changing their part numbers.  I am concerned that because of this, we may
inadvertently be getting lead-free parts and mixing these with lead-bearing
parts.  Concerns are possible tin-whiskers (since pure tin is sometimes used
in lieu of Pb for finishes) and solder joint issues when soldering lead-free
using Sn63 solder.

We have a lot of delivered equipment that I am trying to determine if we
could have these issues.  One way to bound the problem would be to determine
a date by when most part manufacturers starting phasing out Pb from their
part finishes.  Knowing this date, we may be able to accept equipment
manufactured prior to this date with minimum risk.  One possible date may be
the date RoHS started.

Do you folks know of a date that would give me a warm fuzzy that equipment
delivered prior to this date should not be subject to the
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lead-free issues?

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