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Subject:	Re: IPC - 1x, 2x, 3x Repair Process Procedure/Definition
From:	"Stadem, Richard D." <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:	Wed, 22 Mar 2006 16:11:06 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (42 lines)

If a qualified process can be achieved where the board temperature does
not exceed or approach the Tg, and more than one component rework can be
accomplished, then why not do it? Like any other rework process, it
should be qualified. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor G. Hernandez
Sent: Wednesday, March 22, 2006 3:49 PM
To: [log in to unmask]
Subject: [TN] IPC - 1x, 2x, 3x Repair Process Procedure/Definition

Folks,
   Searching for a Standard and /or Procedure/Guideline to perform a
component Removal & Replace Process.   It was my understanding that the
populated board temperature had to return to ambient temperature before
a second work was attempted.

Victor,

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