I agree with your concerns. But this method has been used for a long
time as an approved method of modification of a circuit. It is
documented in IPC 7711/7721. I have seen it used on many different
products with no problems.
But, it Doug Pauls on the environment and application of the product. I
would not use it on military products or medical products. I would also
qualify this modification by subjecting the product to temperature
cycling and perhaps some vibration to ensure its reliability. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of DeVaul, Tim
Sent: Thursday, March 02, 2006 9:01 AM
To: [log in to unmask]
Subject: [TN] Repair to a power supply

I have a question regarding the validity of a proposed repair to a power
supply assembly we produce. It is produced as a class 2 product and the
proposed repair involves staking two SMT caps and a resistor to the PCD
board and running jumper wires to adjacent components. My concern is the
components are only bonded to the board and with vibration and
temperature change that could dislodge the components over time. 

 

Has anyone had experience with this type of repair?

 

 


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