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For what it worth, I can tell you my recent experience in using SACX
for wave soldering over IS410 pcb with Sn100CL as a finishing.
No hot tears, pad lifting, voids. I think I have been luky so far.
Ivan
Il giorno 22/mar/06, alle ore 15:59, Schaefer, Chris ha scritto:
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> *This message was transferred with a trial version of CommuniGate
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> Amol,
>
> I would be interested in seeing this as well. We plan on having a
> Pb free line towards the end of April or beginning of May. We have
> chosen the SAC305 alloy for the wave soldering process, so this
> information is very concerning.
>
> Thanks in advance.
>
> Chris Schaefer
> Suntron Corporation
> Process Engineer
> 540 N. Rogers Road
> Olathe, Kansas 66062
> 913.393.5878
> [log in to unmask]
>
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> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Kane, Amol (349)
> Sent: Wednesday, March 22, 2006 7:26 AM
> To: [log in to unmask]
> Subject: Re: [TN] mixing lead-free solders
>
>
> Sure can,
> Microcracking occurs to the mechanics of cooling of SAC305 alloy.
> To explain crudely, During cooling, Sn dendrites are formed
> starting from the barrel to the fillet surface. The remaining
> liquid alloy is then sucked into the spaces between these Sn
> dendrites. Concurrently, the substrate expands as it goes over the
> wave, and contracts when it cools. This creates stress in the joint
> when the solder is cooling. Due to this we see fissures in the
> fillet surface that is the last to cool (usually the bottom fillet)
>
> I have an x-section picture of a microcrack...will upload it and
> post the link on the forum. IPC 610RevD says that the joint is
> acceptable if (a) the bottom of the crack is seen and (b) the crack
> does not touch the lead or the land
>
> The problem is, you cannot see the bottom of the crack in the
> magnifications mentioned in IPC, and even if you can, the fissures
> do not form linearly into the fillet (the picture will make this
> statement clearer), and hence you may not be seeing the "true"
> bottom. IPC 610 Rev D tries to address this issue based on the info
> the industry as a whole has. Changes will occur to it in the future
> when more data is available, but for now we have the standard to go
> by.
>
> I x-sectioned the joint and also x-rayed it to determine the extent
> of the crack in the fillet. Then based on a sampling plan, I am
> going to x-ray 'n' boards and if they are defect free, shall pass
> the lot. But do I want to keep doing this on lot of board I produce
> on the wave in the future?
>
>
> Amol Kane
> M.S (Industrial Eng.)
> Process Engineer
> Harvard Custom Manufacturing
> 941 Route 38 Owego, NY 13827
> Phone: (607) 687-7669 x349
> [log in to unmask]
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
> Sent: Wednesday, March 22, 2006 8:11 AM
> To: [log in to unmask]
> Subject: Re: [TN] mixing lead-free solders
>
> Amol,
>
> Could you expand on the kind of defects you experienced (cross section
> pictures) and clarify your "testing was a hassle" statements?
>
> Phil Nutting a écrit :
>> Thanks Amol. I'll look at this more closely.
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
>> Sent: Wednesday, March 22, 2006 7:17 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] mixing lead-free solders
>>
>> Hi Phil,
>> Based on the info in the e-mail, you say you are using SAC305 in the
>> wave.......did you do any testing that proved that SAC305 was
>> superior
>> than SN alloy in wave? Or is this an absolute requirement for the
>> product/process?
>>
>> We used SAC 305 in wave and ended up with Hot Tears on greater
>> than 90%
>> of all TH joints........you may have the following issues
>>
>> 1. if you get hot tears, current IPC spec is not sufficient to
>> pass/fail
>> them (because it is impossible to see the bottom of any of the
>> tears @
>> magnifications mentioned in IPC 610)
>> 2. I did some X-sectioning and X-ray analysis of our samples, and
>> even
>> though they turned out OK as per IPC, testing them was a hassle to
>> say
>> the least.
>>
>> So be careful before using SAC305 in wave.
>>
>> Good Luck
>>
>> Amol Kane
>> M.S (Industrial Eng.)
>> Process Engineer
>> Harvard Custom Manufacturing
>> 941 Route 38 Owego, NY 13827
>> Phone: (607) 687-7669 x349
>> [log in to unmask]
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker,
>> Dewey
>> (AZ75)
>> Sent: Tuesday, March 21, 2006 4:36 PM
>> To: [log in to unmask]
>> Subject: Re: [TN] mixing lead-free solders
>>
>> I've seen several presentations that shows that to be an effective
>> combination. All other things being equal, you should be fine.
>> Dewey
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
>> Sent: Tuesday, March 21, 2006 2:07 PM
>> To: [log in to unmask]
>> Subject: [TN] mixing lead-free solders
>>
>> Good afternoon,
>>
>> As we move further into LF conversion I was curious what you, the
>> gurus
>> of TechNet, thought about the possibility of mixing LF solder alloys.
>>
>> We are converting our manufacturing operation to SAC 305 for wave and
>> hand solder. We have a CM that is using Sn100C in their wave.
>> There is
>> the potential to have to manually repair a board built with Sn100C by
>> hand soldering with SAC 305. Are there any reliability issues with
>> this? Assume the board will be properly cleaned after soldering.
>>
>> I haven't looked into our SMT CM and their process, but it could be
>> similar.
>>
>> I'd hate to have to run three or four lines to keep each alloy
>> separate.
>> As it is I must manage Sn/Pb and SAC 305.
>>
>> Thanks in advance.
>>
>> Phil
>>
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