I have a question regarding the validity of a proposed repair to a power
supply assembly we produce. It is produced as a class 2 product and the
proposed repair involves staking two SMT caps and a resistor to the PCD
board and running jumper wires to adjacent components. My concern is the
components are only bonded to the board and with vibration and
temperature change that could dislodge the components over time. 

 

Has anyone had experience with this type of repair?

 

 


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