Amol,
Could you expand on the kind of defects you experienced (cross section
pictures) and clarify your "testing was a hassle" statements?
Phil Nutting a écrit :
> Thanks Amol. I'll look at this more closely.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Kane, Amol (349)
> Sent: Wednesday, March 22, 2006 7:17 AM
> To: [log in to unmask]
> Subject: Re: [TN] mixing lead-free solders
>
> Hi Phil,
> Based on the info in the e-mail, you say you are using SAC305 in the
> wave.......did you do any testing that proved that SAC305 was superior
> than SN alloy in wave? Or is this an absolute requirement for the
> product/process?
>
> We used SAC 305 in wave and ended up with Hot Tears on greater than 90%
> of all TH joints........you may have the following issues
>
> 1. if you get hot tears, current IPC spec is not sufficient to pass/fail
> them (because it is impossible to see the bottom of any of the tears @
> magnifications mentioned in IPC 610)
> 2. I did some X-sectioning and X-ray analysis of our samples, and even
> though they turned out OK as per IPC, testing them was a hassle to say
> the least.
>
> So be careful before using SAC305 in wave.
>
> Good Luck
>
> Amol Kane
> M.S (Industrial Eng.)
> Process Engineer
> Harvard Custom Manufacturing
> 941 Route 38 Owego, NY 13827
> Phone: (607) 687-7669 x349
> [log in to unmask]
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
> (AZ75)
> Sent: Tuesday, March 21, 2006 4:36 PM
> To: [log in to unmask]
> Subject: Re: [TN] mixing lead-free solders
>
> I've seen several presentations that shows that to be an effective
> combination. All other things being equal, you should be fine.
> Dewey
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Nutting
> Sent: Tuesday, March 21, 2006 2:07 PM
> To: [log in to unmask]
> Subject: [TN] mixing lead-free solders
>
> Good afternoon,
>
> As we move further into LF conversion I was curious what you, the gurus
> of TechNet, thought about the possibility of mixing LF solder alloys.
>
> We are converting our manufacturing operation to SAC 305 for wave and
> hand solder. We have a CM that is using Sn100C in their wave. There is
> the potential to have to manually repair a board built with Sn100C by
> hand soldering with SAC 305. Are there any reliability issues with
> this? Assume the board will be properly cleaned after soldering.
>
> I haven't looked into our SMT CM and their process, but it could be
> similar.
>
> I'd hate to have to run three or four lines to keep each alloy separate.
> As it is I must manage Sn/Pb and SAC 305.
>
> Thanks in advance.
>
> Phil
>
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