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March 2006

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Subject:
From:
"Whittaker, Dewey (AZ75)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (AZ75)
Date:
Tue, 21 Mar 2006 13:56:04 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (93 lines)
Sorry, Spell-check was accidentally turned on and changed IPC to IPO. It
was turned by my humor.
Dewey 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
(AZ75)
Sent: Tuesday, March 21, 2006 1:51 PM
To: [log in to unmask]
Subject: [TN] FW: [LF] PCB Mfg. Note for ENIG finish

Note 1: First sentence is OK. Drop the rest.
Note 2: Fabricate PCB per IPO-6012, Class 3.
Note 3; Material to be 1.42 mm [.056 in.] thick per IPO-4101/26 or /126
for Lead-Free applications.
Note 4: Label per IPO-1066.
Dewey

The rest of the Specs are already covered by the first two. The rest is
specific to your design

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Frank W
Sent: Tuesday, March 21, 2006 12:44 PM
To: [log in to unmask]
Subject: Re: [LF] PCB Mfg. Note for ENIG finish

Here's what we propose to use

1. ALL MATERIALS ARE TO BE ROHS COMPLIANT.
   FABRICATE PER ANSI/IPC-A-600,IPC-QE-605,
   IPC-4101,IPC-4552 AND IPC-SM-840 SPECIFICATIONS.

2. MATERIAL: .056 THK (.062 MAX) ROHS COMPLIANT
   FR-4 PER IPC-4101 WITH MINIMUM Tg 170 DEGREES C OR HIGHER,
   Td 340 DEGREES C OR HIGHER AND FLAME RATED UL 94V-0.

3. STACK-UP TO BE SYMMETRICAL ABOUT CORE.
   .005" TRACES ON LAYER 1 ARE 75 OHMS NOMINAL REFERENCES TO LAYER 2.
   .010 WIDTH/.010 SPACE TRACES ON LAYER 1 ARE 100 OHMS (DIFFERENTIAL
PAIR)
   NOMINAL REFERENCED TO LAYER 2. SEE LAYER STACK (FIGURE 1)

4. PLATING TO BE ROHS COMPLIANT PER IPC-4552.
   ELECTROLESS NICKEL/IMMERSION GOLD.

5. UNLESS OTHERWISE SPECIFIED, ALL HOLES TO BE PLATED.
   VIAS TO BE PLUGGED AND TENTED, SURFACE TO BE FLAT ON PRIMARY SIDE.

6. SOLDERMASK BOTH SIDES OF BOARD OVER BARE COPPER WITH ROHS
   COMPLIANT MATERIAL PER ANSI/IPC-SM-840,
   COLOUR SHALL BE GREEN.

7. APPLY SILKSCREEN TO BOTH SIDES OF BOARD USING NON-CONDUCTIVE
   ROHS COMPLIANT WHITE EPOXY INK.

8. PCB MANUFACTURE LOGO, UL MARKING, DATE-CODE
   AND ROHS COMPLIANT SYMBOL TO BE APPLIED ON SOLDER SIDE IN AREA SHOWN

9. CARD EDGE CONNECTOR TO BE ELECTROLYTIC HARD GOLD PLATED
   OVER NICKEL (150-200 MICROINCH NICKEL/50 MICROINCH GOLD)
   AND BEVELLED, SEE DETAIL "A"

10. PACKAGED PCBS TO HAVE NORPAK PART NUMBER LATEST REV
    AND "ROHS COMPLIANT" PLACED ON EACH PACKAGE.



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