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March 2006

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Thu, 2 Mar 2006 08:40:49 -0600
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-----Original Message-----
From: Stadem, Richard D. 
Sent: Thursday, March 02, 2006 8:40 AM
To: [log in to unmask]
Subject: RE: [TN] Printing Ag epoxy

Sumxplore,
I must state that I cannot agree more with Mike's statements below.
Silver-filled epoxy and inks have widely varying properties for
printing, curing, and adherance to different surface finishes. You
should evaluate several to qualify the one that works best for your
process. For example, one that works really well for me is difficult to
print, as it begins to get "flaky" within minutes after being printed.
But it has the best adhesion properties on copper.
In answer to your question comparing it to solder, no epoxy will ever
bond to metal with shear properties better than solder. But it may
adhere well enough to serve its purpose.
One other tip: epoxy to bare copper if possible. I had pwb's
spray-coated with a gel-like substance that was a temporary seal to
prevent oxidation, sort of like OSP, but it cleaned off easily with
alcohol. The boards were shipped with this coating and were packed in a
vacuum sealed shrink-wrap to prevent oxidation. We would get the printer
set up and print the solder coupons and check out everything, then open
the board pack, clean them with alcohol, and then print. This provided
us with a super clean fresh copper surface for optimum bonding. The
cleanliness of the surfaces to be bonded is the primary factor to a
successful process.
Do not use gold as a final surface finish, as it is the most difficult
metal for the conductive epoxies to bond to.    

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
Sent: Thursday, March 02, 2006 7:51 AM
To: [log in to unmask]
Subject: Re: [TN] Printing Ag epoxy

You should check individual data sheets for bond strengths as Ag-epoxy
properties are supplier specific, but generally you should expect to see
about 50-60% reduction in bond strength.
When considering stencil you will need to adjust aperture reduction and
thickness.
- the printed volume of Ag epoxy is same as the final joint volume. [For
solder paste the final joint or solder volume after reflow is only about
half printed volume]
- The Ag epoxy will cure in place, it will not spread like solder.



Regards

Mike Fenner
Indium Corporation


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Sumxplore
Sent: 26 February 2006 00:25
To: [log in to unmask]
Subject: Re: [TN] Printing Ag epoxy

I am using it to mount some chip packages and leds due to specific
requirement stated by customer.
I plan to use 7mils stencil?Somehow,will Ag epoxy with equal bonding
strength as solder after reflow?
thanks.sumxp
----- Original Message -----
From: "Lee parker" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Sunday, February 26, 2006 12:23 AM
Subject: Re: [TN] Printing Ag epoxy


> What is the application?
>
> If you are trying
> Smxp
>
> What is the application?
>
> If you are trying to fill vias this is normally done after forming 
> only
the holes to be filled and consequently a stencil is unnecessary and
would increase the aspect ratio of the hole to be filled.
>
> Best regards
>
> Lee
>
> J. Lee Parker, Ph.D.
> JLP Consultants LLC
> 804 779 3389
>
>
>
> ----- Original Message -----
>   From: sumxp<mailto:[log in to unmask]>
>   To: [log in to unmask]<mailto:[log in to unmask]>
>   Sent: Saturday, February 25, 2006 4:53 AM
>   Subject: [TN] Printing Ag epoxy
>
>
>   Hi,
>
>   Anyone had experiance in using solder paste printer to print Ag
epoxy on
>   pcb?Is it doable?What is the right viscosity on Ag to perform Ag
printing
>   process?
>
>   Thanks.sumxp
>
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