To be included in the IPC T-50...

Stadem, Richard D. a écrit :
> The correct terms are "cupping" (corners of the BGA are higher than the
> middle, and the corner balls are elongated) or "doming" (corners of BGA
> are turned down, solder balls in corners are somewhat flattened, and
> center solder balls are elongated). 
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Whittaker, Dewey
> (AZ75)
> Sent: Monday, March 06, 2006 11:56 AM
> To: [log in to unmask]
> Subject: Re: [TN] Warped BGA - Terminology
>
> Interfacial.
> Dewey 
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of arnaud grivon
> Sent: Monday, March 06, 2006 10:44 AM
> To: [log in to unmask]
> Subject: [TN] Warped BGA - Terminology
>
> Hello TechNet,
>
> What word or expression would you use to describe a warped BGA having:
>
> 1- elongated corner joints ("smiling")
> 2- elongated middle joints ("frowning")
>
> Although the words into brackets are explicit, they look unofficial and
> non-technical. Please provide me with more "official" alternatives.
>
> Best regards.
>
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