You should check individual data sheets for bond strengths as Ag-epoxy
properties are supplier specific, but generally you should expect to see
about 50-60% reduction in bond strength.
When considering stencil you will need to adjust aperture reduction and
thickness.
- the printed volume of Ag epoxy is same as the final joint volume. [For
solder paste the final joint or solder volume after reflow is only about
half printed volume]
- The Ag epoxy will cure in place, it will not spread like solder.
Regards
Mike Fenner
Indium Corporation
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Sumxplore
Sent: 26 February 2006 00:25
To: [log in to unmask]
Subject: Re: [TN] Printing Ag epoxy
I am using it to mount some chip packages and leds due to specific
requirement stated by customer.
I plan to use 7mils stencil?Somehow,will Ag epoxy with equal bonding
strength as solder after reflow?
thanks.sumxp
----- Original Message -----
From: "Lee parker" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Sunday, February 26, 2006 12:23 AM
Subject: Re: [TN] Printing Ag epoxy
> What is the application?
>
> If you are trying
> Smxp
>
> What is the application?
>
> If you are trying to fill vias this is normally done after forming
> only
the holes to be filled and consequently a stencil is unnecessary and would
increase the aspect ratio of the hole to be filled.
>
> Best regards
>
> Lee
>
> J. Lee Parker, Ph.D.
> JLP Consultants LLC
> 804 779 3389
>
>
>
> ----- Original Message -----
> From: sumxp<mailto:[log in to unmask]>
> To: [log in to unmask]<mailto:[log in to unmask]>
> Sent: Saturday, February 25, 2006 4:53 AM
> Subject: [TN] Printing Ag epoxy
>
>
> Hi,
>
> Anyone had experiance in using solder paste printer to print Ag epoxy on
> pcb?Is it doable?What is the right viscosity on Ag to perform Ag
printing
> process?
>
> Thanks.sumxp
>
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