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March 2006

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Subject:
From:
Phil Nutting <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Phil Nutting <[log in to unmask]>
Date:
Thu, 16 Mar 2006 11:04:45 -0500
Content-Type:
text/plain
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text/plain (90 lines)
Wow, I guess I was WAY off base with my reply.  I retreat in disarray. 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott B. Westheimer
Sent: Thursday, March 16, 2006 10:41 AM
To: [log in to unmask]
Subject: Re: [TN] D.I. RINSE

Frank,

Actually you do not want to use DI rinse after chem. clean and prior to
dry
film lamination. Not only expense but the film does not like the surface
left by DI.

Scott B. Westheimer
----- Original Message -----
From: "Frank Conti" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, March 16, 2006 9:29 AM
Subject: [TN] D.I. RINSE


> Technetters:
>
> A question for all pcb fab experts.  Having a disagreement in house on
the
> importance of a D.I. rinse (compared to a fresh water rinse) after
chem.
> clean for inner layer cores prior to resist application.
>
> How important is a D.I. rinse or rinses.  Your input is very much
> appreciated.
>
>
>
> Thanks
>
> Frank Conti
> Quality Process Tech.
> Triangle Circuits of Pgh.
> Phone: 412.828.5322 ext 627
> E-Mail: [log in to unmask]
>
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