Frank - provided that the final rinse post oxide is DI and that you achieve
the necessary cleanliness levels (SEC and SIR) then the rinse water prior to
resist application is not important. Back in the day of Bellcore/ Telcordia
- the requirements were SEC and SIR post oxide since this is the last rinse
step prior to lamination. Remember also that the cores will see multiple
rinse steps during DES prior to oxide as well -
Just my two cents
Regards
Gerard O'Brien
Photocircuits Corporation
-----Original Message-----
From: Frank Conti [mailto:[log in to unmask]]
Sent: Thursday, March 16, 2006 9:29 AM
To: [log in to unmask]
Subject: [TN] D.I. RINSE
Technetters:
A question for all pcb fab experts. Having a disagreement in house on the
importance of a D.I. rinse (compared to a fresh water rinse) after chem.
clean for inner layer cores prior to resist application.
How important is a D.I. rinse or rinses. Your input is very much
appreciated.
Thanks
Frank Conti
Quality Process Tech.
Triangle Circuits of Pgh.
Phone: 412.828.5322 ext 627
E-Mail: [log in to unmask]
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