TECHNET Archives

March 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 1 Mar 2006 23:42:50 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)
Hi John,

I answered the wrong question for you. You were asking Tg and I answered
CTE.

I guess I am getting old... Yipes! I am getting old.

That aside, you are likely not so much interested in the Tg of  the polyimide
as you are in the adhesive used to bond the copper to  the polyimide. (there
are so called adhesiveless constructions where  the polyimide is the only
polymer in the laminate.)

The net is that the fundamental wording of my previous answer still  holds
and you need to know what adhesive is being used. There are a few  common
choices including: acrylics, epoxies and buytral phenolics along with  some
polyimides. Thus you will still need more detail from the provider.

From my rocker (yes, I got back on ;-)
Joe

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2