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March 2006

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Subject:
From:
Steve Kelly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Kelly <[log in to unmask]>
Date:
Tue, 14 Mar 2006 14:51:20 -0500
Content-Type:
text/plain
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text/plain (52 lines)
Hi Werner,
Is there somewhere I can go to review soldering issues on BeCu. We are
having de-wetting issues on a connector which is matte tin over 1.27 um of
nickel over the BeCu. The connector company says the parts meet spec but
that does not help our soldering issue. Thanks. Steve Kelly

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Werner Engelmaier
Sent: Tuesday, March 14, 2006 8:45 AM
To: [log in to unmask]
Subject: Re: [TN] Soldering Issue with SMT connector


Hi Mike,
The most likely reason is that there is no solder joint--it just looks like
one. You did not say what the pin was made of, but from your description it
may
be a non-solderable metal like BeCu. The Au-plating only acts to let liquid
solder cover [=wet in the surfactent sense], but not wet [=in the soldering
sense of forming a metalurgical bond by disolving some of the pin metal].
In addition, butt joints have never worked well, even when the pin/lead
metal
is solderable.



Werner

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