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March 2006

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Subject:
From:
Mike Fenner <[log in to unmask]>
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Date:
Tue, 14 Mar 2006 11:06:43 -0000
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To quote the immortal bard: A rose by any other name is still a rose.  A
large number of finishes have happened not to contain lead for some years.
Now that we call them "Lead Free" it doesn't change anything, they are still
as solderable as they have always been.
As a general rule [lead free] solder compatible surfaces are [leaded] solder
compatible. The finish is to protect/preserve the solderability of the
underlying material, and becomes part of the solder joint (metal finishes)
or is dissipated (organic finishes) by the soldering process.
The exception being BGA, but here we are considering the termination
material being changed not just the surface coat as clearly there isn't one.

Regards

Mike Fenner
Indium Corporation

T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
E: [log in to unmask]
W: www.indium.com
Pb-free: www.Pb-Free.com



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Bloomquist, Ken
Sent: 10 March 2006 14:41
To: [log in to unmask]
Subject: [TN] SN96AG4

Happy Friday Everyone,

Since we had our Friday earlier this week I guess I'll ask a straight
question.

We are currently soldering with SN63 and are getting more and more lead free
parts. We have created a list of lead finishes that we believe work OK in
our tin/lead process.

This morning we got a notice from a component supplier that they will be
switching to SN96AG4. Have any of you had experience soldering this lead
finish with SN63? Have you done any testing of this combination?

Thanks,

KennyB

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