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March 2006

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Subject:
From:
"Kane, Amol (349)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Kane, Amol (349)
Date:
Fri, 10 Mar 2006 06:56:48 -0500
Content-Type:
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Leaded or Lead-free Solder?

Amol Kane
M.S (Industrial Eng.)
Process Engineer
Harvard Custom Manufacturing 
941 Route 38  Owego, NY 13827
Phone: (607) 687-7669 x349
[log in to unmask]

 -----Original Message-----
From:   TechNet [mailto:[log in to unmask]]  On Behalf Of pras chop
Sent:   Friday, March 10, 2006 6:33 AM
To:     [log in to unmask]
Subject:        [TN] 0306 package

Hi,

  We are using an 0306 package for one of our boards. And we have been observing a lot of de-wetting,tombstone and no solder at times.

  Have anybody used these packages and experienced any such issues. Can anyone give details about the stencil aperture opening and other process requirement for this.

  Any ideas for using this package and to solve the above issues??

  Thanks in advance.

  Rgds
  Prashant


---------------------------------
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