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March 2006

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Subject:
From:
Michael McMonagle <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Michael McMonagle <[log in to unmask]>
Date:
Wed, 8 Mar 2006 09:32:09 -0600
Content-Type:
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We are looking for experiences on the best base materials and finishes for
feedthrough pins on glass hermetic seals. We use some small single
feedthroughs in an industrial sensor that sees a variety of shock, vibration
and abuse during its expected 3-5 year lifespan. The current pin is Alloy 52
(NiFe) with a finish of 50uin of Cu topped off with 100-300uin of Sn/Pb. The
pins are staked into the metal case that houses the sensor, which is then
soldered into a small PCBA that is used for interconnecting the sensor to
input/output wires. We occasionally see field failures between the PCBA
soldered to the pin. Though the joint visually exhibits good wetting and
fillet, the joint loses physical adhesion at the solder/pin interface and
becomes open or intermittent. Are there better alternatives for base pin
materials and finishes that could provide a more robust assembly? TIA for
all inputs and insights..

Mike

 


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