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March 2006

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Subject:
From:
"Whittaker, Dewey (AZ75)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Whittaker, Dewey (AZ75)
Date:
Wed, 8 Mar 2006 07:03:59 -0700
Content-Type:
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The attraction to me is that real data overcame the potential residual
effects elsewhere.
Dewey  

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Wednesday, March 08, 2006 6:15 AM
To: [log in to unmask]
Subject: Re: [TN] soldering to PdAg cap

Hi Guy! The use of Sn62 will slow down the leaching of the terminal but
you are still going to lose PdAg thickness. And you should be cautious
on any secondary soldering operations because you have the possibility
of completely leaching off the PdAg termination if you hand solder it a
second time (I have seen components fall off pwas). Does your customer
have real data demonstrating that a nickel or copper barrier layer on
the capacitors will cause a functional issue? The reason I ask is I once
worked with a program where the electrical engineers swore that the
nickel barrier was going to be a huge functional issue. When they
started having capacitors fall off the pwas (our soldering options were
such that I couldn't prevent/minimize the leaching actions) the
equivalent capacitor with a nickel barrier was used with no functional
impact. Funny how real data matters! Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




             Guy Ramsey
             <gramsey@RDCIRCUI
             TS.COM>
To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>
cc

 
Subject
             03/07/2006 01:35          [TN] soldering to PdAg cap
             PM


             Please respond to
             gramsey@rdcircuit
                   s.com






We are leaching the termination off of a capacitor. Our customer
requires a non-magnetic component and has specified a component without
a nickel barrier, because of nickel's ferromagnetic properties.
What can we do?


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