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March 2006

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Subject:
Re: soldering to PdAg cap
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Wed, 8 Mar 2006 07:15:26 -0600
Content-Type:
text/plain
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text/plain (71 lines) 
Hi Guy! The use of Sn62 will slow down the leaching of the terminal but you
are still going to lose PdAg thickness. And you should be cautious on any
secondary soldering operations because you have the possibility of
completely leaching off the PdAg termination if you hand solder it a second
time (I have seen components fall off pwas). Does your customer have real
data demonstrating that a nickel or copper barrier layer on the capacitors
will cause a functional issue? The reason I ask is I once worked with a
program where the electrical engineers swore that the nickel barrier was
going to be a huge functional issue. When they started having capacitors
fall off the pwas (our soldering options were such that I couldn't
prevent/minimize the leaching actions) the equivalent capacitor with a
nickel barrier was used with no functional impact. Funny how real data
matters! Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




             Guy Ramsey
             <gramsey@RDCIRCUI
             TS.COM>                                                    To
             Sent by: TechNet          [log in to unmask]
             <[log in to unmask]>                                          cc

                                                                   Subject
             03/07/2006 01:35          [TN] soldering to PdAg cap
             PM


             Please respond to
             gramsey@rdcircuit
                   s.com






We are leaching the termination off of a capacitor. Our customer requires a
non-magnetic component and has specified a component without a nickel
barrier, because of nickel's ferromagnetic properties.
What can we do?


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