TECHNET Archives

March 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joe Russeau <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joe Russeau <[log in to unmask]>
Date:
Mon, 13 Mar 2006 11:45:58 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (169 lines)
Congratulations Chris!

Joe Russeau
Process Analyst

Precision Analytical Laboratory, Inc.
4106 Cartwright Dr. Ste. A
Kokomo, IN 46902

P: 765-455-1993
F: 765-455-1996
E: [log in to unmask]

----- Original Message -----
From: "Schaefer, Chris" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, March 13, 2006 11:27 AM
Subject: Re: [TN] Solder Surfactants in the solder pot


> Hello all,
>
> I am here and I have survived... I have been blessed with a positive
answer - that being YES! We spent a wonderful 2 days at an 130 year old
mansion being pampered to death and eating tasty food to boot! The night
went perfectly with a 6 course meal with the 3rd course being served in a
vintage serving tray with  the ring wrapped around a white tulip by our own
personal 1800's vintage server. This is when the crying started and I
started my spiel on one knee. After the crying had ceased (for 3.68 minutes)
and asked her for her hand in life she said yes. So thank you all for your
words and now I am considered a fiancé as well as a future husband to a
wonderful young woman.
>
> Thank you very much - it is nice to know that you all are not only an
excellent resource for the industry, but for life as well. God Bless...
>
> As far as George's concerns - I have similar ones when I started the
investigation into this fluid. I have requested ALL quality documentation
from this manufacture as well as all test data (long and short) to aide me
in the qualification of the material into our processes. The requests were
made in November of 05 and I have yet to receive anything, even after a
second request. So maybe they just don't have the information, have the
information but it is inadequate, or forgot all about my requests
altogether.
>
> So where does the oxidized material reside within the solder - these
things do not just up and disappear. If they are broken down but not out,
then are they suspended somehow so they do not come into contact with the
CCA's metallurgy during soldering (unlikely) or are these "byproducts" now
part of the solder thus part of the solder joints on the CCA?
>
> Don't know... I'm sure that some of the metallurgy experts within these
rooms might better answer these questions.
>
> CAS
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of George Carroll
> Sent: Monday, March 13, 2006 10:03 AM
> To: [log in to unmask]
> Subject: Re: [TN] Solder Surfactants in the solder pot
>
>
> First off, I hope all went well for Mr. Schaefer last weekend and hope to
hear a positve verdict.
>
> I got to thinking last weekend (dangerous and smokey) and having seen the
material at APEX and observed the dross and surface tension reduction, I was
impressed. BUT, what are the breakdown or oxidation byproducts and can there
be any trace incorporation of this liquid organic into the molten solder
itself.  If it is, does this tend to create a compressive stress and
facilitate the generation of whiskers?  I would tend to think there would be
no miscibility at all but i would like the thoughts of more metallurgically
educated minds than mine.
>
> George
> State of Franklin
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Chris Schaefer
> Sent: Friday, March 10, 2006 10:27 AM
> To: [log in to unmask]
> Subject: [TN] Solder Surfactants in the solder pot
>
>
> Hello all,
>
> Has anyone within these walls used the newer flavors of solder surfactants
> or is considering using them in their solder pots for wave? Since the cost
> of Lead Free solder is so high and the dross production will be
> significantly greater, we have been considering the use of this material
to
> reduce dross production thus reducing costs. There is a brand name called
> MS2 technologies which is distributed through or made by PK Metals. There
> is a material for Pb free soldering and Pb soldering depending on what you
> are using. I have ordered some of this liquid material to determine the
> effect it has on dross production and other components of flow soldering
> (i.e. joint integrity, affects on the metals inside the solder pot,
> increased or decreased wetting ability, and quite a few more components).
>
> So if anyone has some insight into the new solder surfactants, I would
> appreciate you help and guidance.
>
> Thank You in advance and hope you all have a great weekend. I know I will
> (maybe... hmmmm!) because I am proposing to my girlfriend this weekend -
> hopefully she say's yes - I need all of you prayers ha ha! Chow!
>
> Chris Schaefer
> Suntron Corporation
> Process Engineer
> 540 N. Rogers Road
> Olathe, Kansas 66062
> 913.393.5878
> [log in to unmask]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
> -----------------------------------------------------
> -
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
> -----------------------------------------------------
>

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2