Hi Mike, IPC LF Listservers,

<=========
Hello Ken,

Were you able to find a definitive answer to your question about labeling
PCB vs labeling the assembled PCB?  If I treat the PCB as a component then
it may have a finish label like e3, e4, but what do you do for OSP?  I asked
Enthone this question at IPC/APEX and while they did not have much
confidence, they did not think the board needed to be labeled separately.  I
am also interested in solder temperature and moisture rating on a PCB prior
to assembly.
<==========

If you read the Scope 1.0 of JEDEC Standard 97 JESD97 it presumes the board
(PCB) already has a Pb-free finish.  OSP is one of those finishes.

So Enthone should have said "NOT my problem"

For the moisture, and survivability of laminates at the higher LF
temperatures you are going to have to go back in the archives and read some
reports about Td, and other aspects. About 2 years or so ago.


Yours in Engineering, Dave
YiEngr, MA/NY DDave

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