Hello All,

We are currently experiencing fractures with a SAC alloy BGA (I/O 529) on
an ENIG surface PCB. ICT is finding shorts at locations on the outer rim of
the BGA.

We sent a sample out to the lab, and with cross sectioning, they were able
to determine a fracture along the nickel/SAC intermetallic.  I have heard
of problems with ENIG before, especially with Pb free alloys.

Has anyone else dealt with this before, and if so, how were you able to
overcome this?

All opinions/suggestions would be greatly appreciated.

Thank you,

Danielle L. Casha

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------