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Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Mon, 20 Mar 2006 21:20:35 -0600 |
Content-Type: | text/plain |
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Check your pot temps, we found bumping the pot temp to at least 270 gets better top side fill. Right now it looks pretty good.
-----Original Message-----
From: Leadfree on behalf of Werner Engelmaier
Sent: Mon 3/20/2006 3:13 PM
To: [log in to unmask]
Subject: Re: [LF] L-F Reliability, PTH v SMT
Hi Phil,
With THT the problems are pad lifting, fillet fissures, as well as issues
with having difficulties filling the through-holes. Because of the LF-solder
properties, incomplete hole fills will be more of a problem with LF-solders.
Werner
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