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March 2006

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Subject:
L-F Reliability, PTH v SMT
From:
Phil Nutting <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 20 Mar 2006 15:54:37 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Good afternoon,
 
Am I correct in assuming that SMT solder joint reliability of BGAs and
small pad devices (0201, 0603) is more susceptible than that of the huge
(relative to SMT) solder termination of PTH devices?
 
Are intermetallics and other issues less apt to cause problems in PTH
technology?
 
Or am I way off base?  If you have supporting or refuting documents I'd
love to acquire a copy (sent outside TechNet).
 
Thanks in advance.
 
Phil Nutting
[log in to unmask]

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