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Date: | Mon, 27 Mar 2006 09:09:05 -0800 |
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Steve,
Are you sure that it was the flux? What I have heard is that the copper will dissolve because of the high tin content of lead free solders. This was further illustrated to me when I asked the question about removing insulation and tinning Litz wire. One of the recommendations that was made to me was to use a low tin content solder (70Pb/30Sn) to avoid "necking", or dissolving the copper wire.
I have also heard about problems with trying to rework lead free solder joints...small pads will sometimes just disappear.
-Steve Gregory-
Steve Kelly <[log in to unmask]> wrote:
Good Morning,
Can any one point me to some papers showing problems with no-clean lead
free flux. I just returned from a customer who did some extensive
thermal cycling on some parts we soldered with no -clean lead free 96.5%
tin, 3% silver, and .5% copper. The flux was so active it started to eat
through the copper. Not a pretty sight. Thanks in advance. Steve Kelly
Steve Kelly
PH: (416) 750-8433
FAX: (416) 750-0016
CELL: (416) 577-8433
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