March 23, 2006
Folks, my understanding is that about 50% of the electronic part manufacturers have been eliminating Pb from their part finishes without also changing their part numbers. I am concerned that because of this, we may inadvertently be getting lead-free parts and mixing these with lead-bearing parts. Concerns are possible tin-whiskers (since pure tin is sometimes used in lieu of Pb for finishes) and solder joint issues when soldering lead-free using Sn63 solder.
We have a lot of delivered equipment that I am trying to determine if we could have these issues. One way to bound the problem would be to determine a date by when most part manufacturers starting phasing out Pb from their part finishes. Knowing this date, we may be able to accept equipment manufactured prior to this date with minimum risk. One possible date may be the date RoHS started.
Do you folks know of a date that would give me a warm fuzzy that equipment delivered prior to this date should not be subject to the
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
lead-free issues?