IPC - Association Connecting Electronics Industries is hosting 4
workshops in April.  Don't miss the opportunity to further enhance your
knowledge regarding these topics:

Base Material Basics:  Manufacture and Market

April 11, 2006 - Bannockburn, IL

 

www.ipc.org/calendar/2006/BaseMatl_0406/BaseMatl_4.06.htm

 

All grades of base materials used in printed boards from low-cost,
paper-based (FR-1) to high-speed/high-frequency PTFE will be analyzed in
this course. Specific attention will be given to base materials
compatible with lead free assembly. 

 

The Black Magic of Layer Count Prediction in High Density Design 

April 18, 2006 - Bannockburn, IL

 

www.ipc.org/calendar/2006/BlkMagic_406/BlkMag_0406.htm

 

Often designers are faced with the challenge of estimating how many
conductive layers a particular board design will require. This course
will provide the expertise needed to determine layer count for high
density design.  

 

Designing With Your Thumbs

April 19, 2006 - Bannockburn, IL

 

www.ipc.org/calendar/2006/Desgnyourthumbs_406/DesgnYourThumbs_406.htm


Have you wished someone would compile a list of all the general rules
for laying out different kinds of boards? How about having a place to go
for all of the guidelines for routing, planes, stackup, high speed, EMI
and more? This course will provide general "rules of thumb" for the ways
things should be done and how to achieve successful board designs.

 

Signal Integrity Control in for High Speed Circuits

April 20, 2006 - Bannockburn, IL

 

http://www.ipc.org/calendar/2006/SigInt_0406/SigInt_0406.htm
<http://www.ipc.org/calendar/2006/SigInt_0406/SigInt_0406.htm> 

 

This course is a compete introduction to the concepts needed in high
speed circuit and printed circuit design to ensure success with designs
utilizing today's and tomorrow's fast and ultra fast ICs.  Don't miss
this opportunity to learn more about Signal Integrity Control in for
High Speed Circuits.

 

 

 

 

 

 


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