I believe that you will have some issued getting the CB-100 into that
via size.  We have found .010" to be difficult at .062" - CB-100 is a
stiff material similar to peanut butter and does not flow well into
smaller vias.  Out current flag is set to a .012" via for CB-100 and
both Taiyo and Peters make a conductive fill that has better flow
properties.  You must also be using a vacuum system to apply the
material which aides in drawing the material into the hole.  Voids in
the fill cannot be tolerated when thermal dissipation is needed.  

Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED 
           76 Technology Drive - POB 1890 
              Brattleboro, Vermont 05302
                Voice - 802.257.4571 ext 37 
                    Fax - 802.257.0011
                       <http://www.vtcircuits.com/> 
                           

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Kelly
Sent: Friday, February 10, 2006 4:51 PM
To: [log in to unmask]
Subject: [TN] Via fill

Good Afternoon,
We have a rigid flex design that is asking us to fill the through hole
vias. Thickness of rigid flex is .037 nominal. Finished hole size after
perfect drilling and perfect plating is .0052. Via fill material is
CB100 (DuPont silver). 9000 vias per panel.  Any thoughts or is the
customer dreaming.  Thanks in advance . Steve Kelly

Steve Kelly
PH: (416) 750-8433
FAX: (416) 750-0016
CELL: (416) 577-8433


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