I do not show the Peters SD-2795 material listed in the NASA 1124 Pub,
or ESA testing records as Peters is a European company. As a note,
using the material by filling a via, then sealing with an over plate
would not pose issues with CVCM or WVR as the material sealed in the via
cannot experience weight loss from liberation of condensables. This
seems not to be an issue in the via will application. This is a similar
position to not requiring the testing of E-Glass as these reinforcements
are composite to the epoxy system.
Jeffrey Bush
Director, Quality Assurance and Technical Support
VERMONT CIRCUITS INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 37
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Decker
Sent: Friday, February 10, 2006 9:56 AM
To: [log in to unmask]
Subject: [TN] Via fillings question.
OK, fillings may sound like a dental term, but I mean via plugging
materials. :-) I'm looking for what materials I can use to plug a .010"
via and meat NASA specs for out gassing, etc. I have some names so far,
but no data on if they are approved for space apps. The names are so
far:
Peters fill (maybe this is a spec number, SD2795?) and is
non-conductive?
CB100, which I know is OK for space and conductive, but FAB would need a
jack hammer to get it in a .010" hole so that's out.
And last I have is San-IE, which I understand is non-conductive and
supposed to be good in space, but San-IE what?
For this project I don't need conductive but they will be under a BGA so
it will need to be flat and covered with solder mask. I got that part
covered, (no pun intended) but I just need to know what to call out on
my drawing. Any help would be great.
Later.
Scott Decker
AKA: Padmasterson
Broad Reach Engineering CAE
Ph. 480-377-0400 Ext. 34
FAX. 480-968-4597
Tempe, AZ.
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