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February 2006

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Subject:
From:
Dwight Mattix <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dwight Mattix <[log in to unmask]>
Date:
Thu, 2 Feb 2006 10:08:05 -0800
Content-Type:
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MR.(?) Hoover!!!

That's makes him sound sooo respectable.  He's still just "Groovy" to most 
of us.

dw


At 10:00 AM 2/2/2006, Marcello Brett Malteze wrote:
>Hi Jeffrey,
>
>         Tks a lot for you feedback and do you have the papers from Mr.
>Hoover?Would you send to me?
>
>Tks a lot
>
>
>Marcello Brett Malteze
>Mechanical Process Engineering
>Multek Brazil
>Phone: + 55 11 3749 8384
>Mobile: + 55 11 9468 4833
>Skype: mbrett73
>Email: [log in to unmask]
>
>
>-----Original Message-----
>From: Jeffrey Bush [mailto:[log in to unmask]]
>Sent: quinta-feira, 2 de fevereiro de 2006 11:32
>To: TechNet E-Mail Forum; Marcello Brett Malteze
>Subject: RE: [TN] Via on Hole process
>
>Buried vias should not need to be filled as the bonding material should
>adequate to fill these features to minimum standard.
>
>If you as discussing the filling of thru-hole vias, I would recommend a
>Peters SD2795 and the investment in a planarization unit.  Traditional
>scubbing is problematic and we have attempted using the Ishii Hyoki
>mechanical as well as a chemcut unit.  The best process we have determined
>is using a Pola&Massa process to remove the surface epoxy as well as reduce
>the surface copper improved by the plating of the via prior to filling.
>Your Dave Hoover presented a great paper at SMTA/Dallas in 2004, where the
>various processes are discussed for via filling.
>
>Jeffrey Bush
>Director, Quality Assurance and Technical Support VERMONT CIRCUITS
>INCORPORATED
>            76 Technology Drive - POB 1890
>               Brattleboro, Vermont 05302
>                 Voice - 802.257.4571 ext 37
>                     Fax - 802.257.0011
>                        <http://www.vtcircuits.com/>
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Marcello Brett Malteze
>Sent: Thursday, February 02, 2006 6:17 AM
>To: [log in to unmask]
>Subject: [TN] Via on Hole process
>
>Hello all,
>
>We are installing the via on hole process and iīm looking for more
>informationīs regarding to Ink Supplier to fill the buried vias , someone
>that could describe the flow process and if it is possible to run
>planarization on a normal Scrubex machine not Ishiihyki.
>
>Tks a lot,
>
>Brett
>
>
>
>Marcello Brett Malteze
>Mechanical Process Engineering
>Multek Brazil
>Phone: + 55 11 3749 8384
>Mobile: + 55 11 9468 4833
>Skype: mbrett73
>Email: [log in to unmask]
>
>
>
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