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| Date: | Thu, 2 Feb 2006 16:00:47 -0200 |
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Hi Jeffrey,
Tks a lot for you feedback and do you have the papers from Mr.
Hoover?Would you send to me?
Tks a lot
Marcello Brett Malteze
Mechanical Process Engineering
Multek Brazil
Phone: + 55 11 3749 8384
Mobile: + 55 11 9468 4833
Skype: mbrett73
Email: [log in to unmask]
-----Original Message-----
From: Jeffrey Bush [mailto:[log in to unmask]]
Sent: quinta-feira, 2 de fevereiro de 2006 11:32
To: TechNet E-Mail Forum; Marcello Brett Malteze
Subject: RE: [TN] Via on Hole process
Buried vias should not need to be filled as the bonding material should
adequate to fill these features to minimum standard.
If you as discussing the filling of thru-hole vias, I would recommend a
Peters SD2795 and the investment in a planarization unit. Traditional
scubbing is problematic and we have attempted using the Ishii Hyoki
mechanical as well as a chemcut unit. The best process we have determined
is using a Pola&Massa process to remove the surface epoxy as well as reduce
the surface copper improved by the plating of the via prior to filling.
Your Dave Hoover presented a great paper at SMTA/Dallas in 2004, where the
various processes are discussed for via filling.
Jeffrey Bush
Director, Quality Assurance and Technical Support VERMONT CIRCUITS
INCORPORATED
76 Technology Drive - POB 1890
Brattleboro, Vermont 05302
Voice - 802.257.4571 ext 37
Fax - 802.257.0011
<http://www.vtcircuits.com/>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Marcello Brett Malteze
Sent: Thursday, February 02, 2006 6:17 AM
To: [log in to unmask]
Subject: [TN] Via on Hole process
Hello all,
We are installing the via on hole process and iīm looking for more
informationīs regarding to Ink Supplier to fill the buried vias , someone
that could describe the flow process and if it is possible to run
planarization on a normal Scrubex machine not Ishiihyki.
Tks a lot,
Brett
Marcello Brett Malteze
Mechanical Process Engineering
Multek Brazil
Phone: + 55 11 3749 8384
Mobile: + 55 11 9468 4833
Skype: mbrett73
Email: [log in to unmask]
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