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Date: | Tue, 7 Feb 2006 14:51:46 -0500 |
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Will not be at APEX to attend this meeting, however would like to be on
this committee to support wherever I can.
Rich Kraszewski
Senior Advanced Manufacturing Engineer
Kimball Electronics Group - KEDS
1015 W. 15th Street
Auburn, Indiana 46706
[log in to unmask]
260.925.8719
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
Sent: Tuesday, February 07, 2006 10:19 AM
To: [log in to unmask]
Subject: [TN] Solder paste spread as a measure of solderablity
Hello -
We will be starting a new focus topic at the Thursday meeting of 5-23d
Committee - Alternate Final Board Finishes Task Group. That meets at
3:15 on
Thursday in Room 208A at Expo/Apex.
We are looking to develop standard testing to measure solderablity of
all
board finishes, particularly after stress - storage, heat, humidity,
etc. Our
task group inputs to the J-003 Board Solderablity Standards Committee.
Issues may come up including:
A standard dot method for all finishes would be desireable, if
possible.
Is there a "standard solder paste"? that can be used
Slump versus spread + hot slump method
Possibly create an "index" for paste spread
Evaluation of paste/finish combination
Collect information on spread - possible round table in future.
If you cannot attend, all comments on the possible test methodology
would be
appreciated.
Dennis Fritz, MacDermid
Committee Chairman - 5-23d Alt Finishes
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Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
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