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February 2006

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Tue, 7 Feb 2006 14:51:46 -0500
Content-Type:
text/plain
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text/plain (84 lines)
Will not be at APEX to attend this meeting, however would like to be on
this committee to support wherever I can. 

Rich Kraszewski 
Senior Advanced Manufacturing Engineer
Kimball Electronics Group - KEDS
1015 W. 15th Street 
Auburn, Indiana 46706
[log in to unmask]
260.925.8719



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
Sent: Tuesday, February 07, 2006 10:19 AM
To: [log in to unmask]
Subject: [TN] Solder paste spread as a measure of solderablity

Hello - 
 
We will be starting a new focus topic at the Thursday  meeting of 5-23d 
Committee - Alternate Final Board Finishes Task Group.   That meets at
3:15 on 
Thursday in Room 208A at Expo/Apex.  
 
We are looking to develop standard testing to measure  solderablity of
all 
board finishes, particularly after stress - storage, heat,  humidity,
etc.   Our 
task group inputs to the J-003 Board  Solderablity Standards Committee.

 
Issues may come up including:
 
    A standard dot method for all finishes  would be desireable, if
possible. 

Is there a "standard solder paste"? that can be  used

Slump versus spread + hot slump method

Possibly create an "index" for paste  spread

Evaluation of paste/finish  combination

Collect information on spread - possible round  table in future. 
 
If you cannot attend, all comments on the possible test methodology
would  be 
appreciated.
 
Dennis Fritz, MacDermid
Committee Chairman - 5-23d Alt Finishes



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