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| Date: | Thu, 2 Feb 2006 09:18:09 -0800 |
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At 05:31 AM 2/2/2006, Jeffrey Bush wrote:
>Buried vias should not need to be filled as the bonding material should
>adequate to fill these features to minimum standard.
Whoa, better qualify that statement. Many buried via designs cannot be
built successfully without pre-filling the buried vias. It's not uncommon
for us to 100-200 holes/in^2 in a buried sub now days.
Bonding material may not be adequate to fill buried vias. It depends on
the via volume and local density of vias to be filled. Be sure to look at
areas with high buried via density (e.g. thermal via farms).
dw
>If you as discussing the filling of thru-hole vias, I would recommend a
>Peters SD2795 and the investment in a planarization unit. Traditional
>scubbing is problematic and we have attempted using the Ishii Hyoki
>mechanical as well as a chemcut unit. The best process we have determined
>is using a Pola&Massa process to remove the surface epoxy as well as
>reduce the surface copper improved by the plating of the via prior to
>filling. Your Dave Hoover presented a great paper at SMTA/Dallas in 2004,
>where the various processes are discussed for via filling.
>
>Jeffrey Bush
>Director, Quality Assurance and Technical Support
>VERMONT CIRCUITS INCORPORATED
> 76 Technology Drive - POB 1890
> Brattleboro, Vermont 05302
> Voice - 802.257.4571 ext 37
> Fax - 802.257.0011
> <http://www.vtcircuits.com/>
>
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Marcello Brett Malteze
>Sent: Thursday, February 02, 2006 6:17 AM
>To: [log in to unmask]
>Subject: [TN] Via on Hole process
>
>Hello all,
>
>We are installing the via on hole process and iīm looking for more
>informationīs regarding to Ink Supplier to fill the buried vias , someone
>that could describe the flow process and if it is possible to run
>planarization on a normal Scrubex machine not Ishiihyki.
>
>Tks a lot,
>
>Brett
>
>
>
>Marcello Brett Malteze
>Mechanical Process Engineering
>Multek Brazil
>Phone: + 55 11 3749 8384
>Mobile: + 55 11 9468 4833
>Skype: mbrett73
>Email: [log in to unmask]
>
>
>
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