Hello - 
 
We will be starting a new focus topic at the Thursday  meeting of 5-23d 
Committee - Alternate Final Board Finishes Task Group.   That meets at 3:15 on 
Thursday in Room 208A at Expo/Apex.  
 
We are looking to develop standard testing to measure  solderablity of all 
board finishes, particularly after stress - storage, heat,  humidity, etc.   Our 
task group inputs to the J-003 Board  Solderablity Standards Committee.  
 
Issues may come up including:
 
    A standard dot method for all finishes  would be desireable, if possible. 

Is there a “standard solder paste”? that can be  used

Slump versus spread + hot slump method

Possibly create an “index” for paste  spread

Evaluation of paste/finish  combination

Collect information on spread – possible round  table in future. 
 
If you cannot attend, all comments on the possible test methodology would  be 
appreciated.
 
Dennis Fritz, MacDermid
Committee Chairman - 5-23d Alt Finishes



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