TECHNET Archives

February 2006

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Baski Devre <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Baski Devre <[log in to unmask]>
Date:
Mon, 6 Feb 2006 17:28:45 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (34 lines)
Dear Technetters

We have been producing PCB with both panel plating and pattern plating 
method. We want to learn that if there is accepted criteria about the 
total manufacturing waste of both these methods each. And which waste 
percentage of these PCBs are acceptable or is there any respected 
reference for the waste rate

Best Regards

-- 
Yusuf GÖMEÇ
Product Quality Engineer

BASKI DEVRE SAN ve TIC LTD STI
Ceyhan Sk. No:10 34896 Pendik-Istanbul-Turkey

Tel: 00 90 216 3901036 (4 Hat/Line)-173(Extention)
     00 90 216 4836560 (4 Hat/Line)-173(Extention)
Fax: 00 90 216 3544941
     00 90 216 4913269
Gsm: 00 90 533 6579897
     00 90 533 7480014 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2