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February 2006

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Subject:
From:
Michael McMonagle <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Michael McMonagle <[log in to unmask]>
Date:
Tue, 28 Feb 2006 14:11:43 -0600
Content-Type:
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text/plain (261 lines)
In a previous life at a CM, we had a similar situation to Ken's. Lots of
right angle connectors at board's edge, about 30% of the pins tied to
multiple layers of internal power and ground planes. Our specific scenario
was even a little worse, in that the board was .090 and the connector
designed for a .063 board. So we had both insufficient barrel fill AND
minimal/no lead protrusion. This was a wave soldered board, and we threw
everything we could think at it. Oven preheating for an hour prior to wave
preheating to minimize laminate shock, coupled with manual fluxing of the
topside of the connector and the slowest speed we could run without
re-reflowing topside SMT parts (that would then slide down the board, eek!).
After all that, the best we could get was 30-40% on some pins based on
destructive cross-sections of the joints. By reviewing the fab data, we
identified all the 'problem pins' and then did destructive pull testing to
rip the pins out of the insufficient joints. In every case the pin failed
before the joint, the data convinced the customer that they still had a
reliable assembly even though it did not meet IPC-A-610.

If you have a non-standard design, layout or component, you have some
'wiggle room' for negotiation in Section 1.2 (Purpose) and Section 1.3
(Specialized Design)....

Mike McMonagle
Quality Manager
OYO Geospace
7007 Pinemont Drive
Houston, TX 77040
Ph 713-986-8650
Fx 713-986-8725


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Schaefer, Chris
Sent: Tuesday, February 28, 2006 1:29 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Joint Inspection

This is true. My point is that the customer may allow the 50% fill if
approached using some process data or other to support it. IPC rev. D ha ha!
we don't have that and won't for quite a while. Does rev. D say anything
different about this criteria? I know from a seminar I went to a while back
done by Keller in which depending on the end application and environment -
less solder is in fact better because it is not a rigid joint.

Regards,

CAS

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Barmuta, Mike
Sent: Tuesday, February 28, 2006 1:22 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Joint Inspection


Hi Chris: I think if you look closely at the wording in 6.3.1, 50 % hole
fill is not acceptable for class 3, only class 1 and 2.  
Ken is building to class 3.

BTW You are probably looking at IPC-A-610 rev C. The new one is rev D
section 7.5.5.1

	
Regards
	
Michael Barmuta
	
Staff Engineer
	
Fluke Corp.
	
Everett WA
	
425-446-6076

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Schaefer, Chris
Sent: Tuesday, February 28, 2006 11:02 AM
To: [log in to unmask]
Subject: Re: [TN] Solder Joint Inspection

Section 6.3.1 speaks about a 50% vertical hole fill on sections of the
board that are considered thermal planes or conductor planes. It sounds
like this applies, but it may require something from your customer to
allow this or for reasons of stress it is required - not sure. We have
issues such as your and we have spoken with the customer and have
received the ok to allow a 50% fill versus the traditional 75%.

I agree with the previous point, but it will not allow for any process
anomalies that occur on occasion. If for some reason the connector has
issues related to the solderability, then you have a problem. In another
scenario if the area/ connector has not been proper fluxed or achieved
proper solder contact - it might look fine on the outside, but has not
achieved the solderability levels you desire.

Food for thought...

Have a nice day guys!

Chris Schaefer
Suntron Corporation
Process Engineer
540 N. Rogers Road
Olathe, Kansas 66062
913.393.5878
[log in to unmask] 

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of John Berg
Sent: Tuesday, February 28, 2006 12:44 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Joint Inspection


If x-ray is not an option, you need to set up a soldering process that
would not require inspection. On a thermally relieved pad that does not
get sufficient fill, you need to preheat the pad area prior to hand
soldering to compensate for the heat sinking. If you can get a dummy
populated board, preheat it to a known reference level, and then remove
the connector body to examine the % fill. Find the minimum reference
preheat that will obtain your desired % fill. If you can't get a dummy
populated board, you can use a few production boards to find the
reference preheat by utilizing an ouitside x-ray service to determine
the % fill.

>>> [log in to unmask] 2/28/2006 7:55 AM >>>
We are having a heck of a time inspecting some solder joints and could
use your help.

Per Class 3 a solder joint is supposed to have at least a 75% fill. We
have a circuit board that has large ground planes and hand soldered
connectors that are impossible to inspect for top side solder.

We do not have access to an x-ray and are wondering if there are any
clever ways to inspect these solder joints.

Thanks,

KennyB

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