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February 2006

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Subject:
From:
"Schaefer, Chris" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Schaefer, Chris
Date:
Tue, 28 Feb 2006 13:01:33 -0600
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Section 6.3.1 speaks about a 50% vertical hole fill on sections of the board that are considered thermal planes or conductor planes. It sounds like this applies, but it may require something from your customer to allow this or for reasons of stress it is required - not sure. We have issues such as your and we have spoken with the customer and have received the ok to allow a 50% fill versus the traditional 75%.

I agree with the previous point, but it will not allow for any process anomalies that occur on occasion. If for some reason the connector has issues related to the solderability, then you have a problem. In another scenario if the area/ connector has not been proper fluxed or achieved proper solder contact - it might look fine on the outside, but has not achieved the solderability levels you desire.

Food for thought...

Have a nice day guys!

Chris Schaefer
Suntron Corporation
Process Engineer
540 N. Rogers Road
Olathe, Kansas 66062
913.393.5878
[log in to unmask] 

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-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of John Berg
Sent: Tuesday, February 28, 2006 12:44 PM
To: [log in to unmask]
Subject: Re: [TN] Solder Joint Inspection


If x-ray is not an option, you need to set up a soldering process that would not require inspection. On a thermally relieved pad that does not get sufficient fill, you need to preheat the pad area prior to hand soldering to compensate for the heat sinking. If you can get a dummy populated board, preheat it to a known reference level, and then remove the connector body to examine the % fill. Find the minimum reference preheat that will obtain your desired % fill. If you can't get a dummy populated board, you can use a few production boards to find the reference preheat by utilizing an ouitside x-ray service to determine the % fill.

>>> [log in to unmask] 2/28/2006 7:55 AM >>>
We are having a heck of a time inspecting some solder joints and could
use your help.

Per Class 3 a solder joint is supposed to have at least a 75% fill. We
have a circuit board that has large ground planes and hand soldered
connectors that are impossible to inspect for top side solder.

We do not have access to an x-ray and are wondering if there are any
clever ways to inspect these solder joints.

Thanks,

KennyB

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